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Memory Interface

DDR4/DDR5 Routing Calculator

DDR4 | DDR5 | LPDDR4/5

Review routing guidance for DDR memory interfaces. Differential calculation is temporarily unavailable; use a validated coupled-line solver for clock and strobe pairs.

DDR Data Rates and Impedance Targets

StandardData Rate
DDR4-24002400 MT/s
DDR4-32003200 MT/s
DDR5-48004800 MT/s
DDR5-64006400 MT/s

Impedance targets for DDR depend on the memory controller or SoC platform, the topology and the DRAM generation. There is no single value for all DDR4/DDR5 designs, so none is stated here; take the single-ended and differential targets from your SoC/PHY vendor's PCB design guideline and the memory vendor's datasheet.

DDR Signal Groups & Requirements

Data Signals (DQ/DQS)

  • • DQ: single-ended; impedance target from your SoC/PHY guideline
  • • DQS/DQS#: differential pair; target from your SoC/PHY guideline
  • • Length match DQ to DQS within byte lane
  • • Tolerance and intra-pair / inter-pair skew budgets are defined in the current interface specification and your SoC/PHY datasheet; check them there. This page does not state them.
  • • Route as tight groups by byte lane

Address/Command (ADDR/CMD)

  • • Address: single-ended; target from your SoC/PHY guideline
  • • Command: single-ended; target from your SoC/PHY guideline
  • • Length match to clock
  • • Tolerance and intra-pair / inter-pair skew budgets are defined in the current interface specification and your SoC/PHY datasheet; check them there. This page does not state them.
  • • T-topology or fly-by routing

Clock (CK/CK#)

  • • CK/CK#: differential pair; target from your SoC/PHY guideline
  • • Reference signal for ADDR/CMD
  • • Route with matched lengths
  • • Keep away from noisy signals
  • • Consider termination strategy

Control Signals

  • • CS#, CKE, ODT: single-ended; target from your SoC/PHY guideline
  • • Reset#: Standard GPIO
  • • Check timing requirements in your SoC/PHY datasheet
  • • Match to clock group
  • • Standard routing rules apply

DDR PCB Design Guidelines

📏

Length Matching

Tolerance and intra-pair / inter-pair skew budgets are defined in the current interface specification and your SoC/PHY datasheet; check them there. This page does not state them.

🔀

Fly-By Topology

DDR4/5 uses fly-by topology for ADDR/CMD/CLK. Signals visit each DIMM/chip in sequence. Write leveling compensates for timing skew.

⚡

Termination

Check your SoC/PHY and memory datasheets for on-die termination (ODT) and external termination requirements for your configuration.

Review Your DDR Stackup

Enter your own stackup (dielectric height, Er, and copper thickness) in the impedance calculator for isolated-line single-ended estimates, because trace width depends on stackup. Differential calculation is temporarily unavailable.

DDR Design FAQ

What impedance for DDR4?

There is no single impedance for all DDR4 designs: the single-ended and differential targets depend on the memory controller or SoC platform and the topology. Take them from your SoC/PHY vendor PCB guideline and the memory datasheet. This page does not state them, nor tolerance and skew budgets.

How tight should length matching be?

Tolerance and intra-pair / inter-pair skew budgets are defined in the current interface specification and your SoC/PHY datasheet; check them there. This page does not state them.

What's fly-by topology?

DDR4/5 routes clock and address signals to each memory chip in sequence (not parallel). Write leveling compensates for the resulting timing skew.

Do I need special PCB materials for DDR?

Check the current interface specification and your SoC/PHY datasheet for PCB material requirements for your channel.

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